Welcome to the 2017 28th Annual SEMI® Advanced Semiconductor Manufacturing Conference!

Home Page Image

As microelectronics content continually expands into more and more of our daily lives, regular discussions among industry professionals about continued advancements in commercial semiconductor manufacturing have become more and more essential.  These discussions are the essence of ASMC 2017 where industry experts and innovators gather to share insights around manufacturing excellence, productivity and the future trends of the semiconductor industry. 

Once again, the conference offers a host of stimulating presentations, from keynotes to technical sessions and tutorials, addressing a wide variety of cutting-edge topics in microelectronic device fabrication.  Beginning with a welcome reception, and extending over the next three days, the ASMC 2017 program is filled with opportunities for networking with industry peers, and for learning and sharing knowledge on new, and best-method, semiconductor manufacturing practices and concepts vital to continued progress in the field.

We hope you will enjoy our 28th annual conference in Saratoga Springs, New York.  Sincere thanks to our technical committee, session chairs, speakers, volunteers and sponsors for their support of this conference. Their contributions are invaluable and we are truly grateful for their efforts and support.  Special thanks to Dr. Delphine LeCunff/STMicroelectronics and Russell Dover/Lam Research for their leadership as this year’s conference co-chairs.  We also acknowledge the tireless work of ASMC technical committee members who represent the global microelectronics supply chain. 

A Note to Attendees:

You must check-in at the ASMC registration desk to pick up your registration packet, including name badge, conference information, and reception ticket(s).   ASMC 2018 presentations (for which we have permission) will be shared immediately following the conference.

ASMC 2018 Proceedings

This product was produced for SEMI and IEEE by Omnipress. Abstracting is permitted with credit to the source.  Libraries are permitted to photocopy beyond the limit of U.S. copyright law for private use of patrons those articles in this volume that carry the code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA.  For other copying, reprint or republication permission, write to IEEE Copyrights Manager, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854 USA or contact SEMI.  All rights reserved. Copyright © 2017 IEEE.

Duplication of this product and its content in print or digital form for the purpose of sharing with others is prohibited without permission from the SEMI and IEEE.  In no event will Omnipress or its suppliers be liable for any consequential or incidental damages to your hardware or other software resulting from the installation and/or use of this product.  No part of the product navigation and "Help" files may be reproduced or used without written permission from Omnipress. © 2017 Omnipress - All rights reserved.

For technical issues and support, Click Here.

IEEE Catalog Number: CFP17ASC-ART
ISBN: 978-1-5090-5448-0
Online ISSN: 2376-6697