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  • Session 1 - Yield Enhancement I
  • Session 1 - Yield Enhancement I

    1.1 Chasing Ghosts:  How an SRAM Detected the Subtle Impact of Stray Light

    • Stephen Lucarini, GLOBALFOUNDRIES Advanced Technology Development ;
    • Bachir Dirahoui, GlobalFoundries ;
    • Weihao Weng, GlobalFoundries ;
    • Richard Hafer, GlobalFoundries ;
    • Laura Safran, GlobalFoundries ;
    • Sweta Pendyala, GlobalFoundries ;
    • Karl Barth, GlobalFoundries ;
    • Timothy Brunner, GLOBALFOUNDRIES ;
    • Zhigang Song, GlobalFoundries ;
    • Brett Engel, GlobalFoundries ;
    • David Clark, GlobalFoundries ;
    • Keliang He, GlobalFoundries ;
    • Catherine Gow, GlobalFoundries ;
    • Anne Friedman, GlobalFoundries

    Chasing Ghosts:  How an SRAM Detected the Subtle Impact of Stray Light

    1.2 Dual lobe shading of surface copper voids in copper metal lines

    • Gagan Aggarwal, Micron Technology ;
    • Daniel Henke, Micron Technology ;
    • Seiichi Takedai, Micron Technology ;
    • Rajyalakshmi Anantatmukala, Micron Technology ;
    • Brian Huber, Micron Technology

    Dual lobe shading of surface copper voids in copper metal lines

    1.3 Nested Interconnect Macro Electrical Yield Improvement for Advanced Triple Patterning Integration

    • Mary Claire Silvestre, Globalfoundries ;
    • Ming He, Globalfoundries ;
    • Anbu Selvam KM Mahalingam, Globalfoundries ;
    • Craig Child, Globalfoundries ;
    • Alycia Roux, Globalfoundries ;
    • Chun Hui Low, Globalfoundries ;
    • Daniel Fisher, Globalfoundries ;
    • Zhou Yue, Globalfoundries ;
    • Park DeNeil, Globalfoundries ;
    • Mert Karakoy, Globalfoundries

    Nested Interconnect Macro Electrical Yield Improvement for Advanced Triple Patterning Integration

    1.4 Raman Spectroscopy Analysis Utilized to Identify Stess Induced Leakage from Power and High Speed Technologies Using Deep Trench Isolation Schemes

    • David Parker, Texas Instruments Incorporation PDE Group MFAB ;
    • Thanas Budri, Texas Instruments Incorporation PCL Materials Characterization MLAB

    Raman Spectroscopy Analysis Utilized to Identify Stess Induced Leakage from Power and High Speed Technologies Using Deep Trench Isolation Schemes

    1.5 Defect Improvement by Optimizing Electroplating in BEOL Sub-50nm Pitch

    • Ketan Shah, Global Foundries ;
    • Shafaat Ahmed, Global Foundries ;
    • Tien Jen Cheng, Global Foundries ;
    • Adam daSilva, Global Foundries ;
    • Mukta Sharma, Global Foundries ;
    • Anbu Selvam KM Mahalingam, Globalfoundries ;
    • Dinesh Koli, Global Foundries ;
    • Stephan Grunow, Global Foundries ;
    • Craig Child, Globalfoundries

    Defect Improvement by Optimizing Electroplating in BEOL Sub-50nm Pitch